ASC 2017 Innovation Award Goes to Organik Kimya
Organik Kimya’s Innofix Technology won the Innovation Award at the Adhesive and Sealant Convention & Expo held in Atlanta, Georgia. The award was recieved by Simone Kaslowski, CEO of the company.
Organik Kimya has developed a novel process for packaging of hot melt pressure sensitive adhesive (HMPSA) specifically for hygiene market. Innofix Signature Packaging Technology includes coating of HMPSA with a substantially tack-free hot melt adhesive as a replacement to blown films, offering variety of end use advantages in ease of use, melting speed, filter and nozzle change frequency, energy saving and sustainability.